Pryroda Engineering

Pryroda Engineering

Titan-P: a wafer slicing wire saw with a diamond coated wire

Highlights

Titan-P: the wafer slicing saw and its controlling unit.
Titan-P: the wafer slicing saw and its controlling unit. Equipped with SIEMENS modules and components.
  • Good productivity and reliability;
  • Successfully operated by renowned sapphire manufacturers;
  • Comes along with an extensive technological support for implementation;
  • Covered for after-sale support and parts;

Titan-P: A view on the working area with the ingot rotating mechanism and the drums with tight wire.
Titan-P: A view on the working area with the ingot rotating mechanism and the drums with tight wire.

Description

The device is intended for slicing of poly crystal and single crystal ingots, notably of sapphire monocrystals, as well as for slicing of other hard or superhard materials. Slicing is done by a diamond coated wire.

Technical Characteristics (Main configuration)

Diameter of sliced ingots, mm: up to 300mm

Length of sliced ingots, mm: up to 150

Weight of sliced ingots, maximum, kg: 11.5

Wire winding speed, m/s: 0.3 – 15

Transversal approach speed,

mm/min.: 0.07 – 1

Number of wafers from one cycle of cutting (thickness of 0.7mm), pieces: 149

Cutting of a large diameter sapphire ingot (about 11 inches) into wafers.
Cutting of a large diameter sapphire ingot (about 11 inches) into wafers.

Duration of one cycle with a sapphire ingot of 50.8mm in diameter and 150mm in length (resulting in 149 wafers), hours: 2 – 2.5

WARP, micro meters: 10 – 30

Ra, micro meters: 0.7 – 0.8

Weight of the device, kg: 1310

Watch industry configuration:

One cycle of slicing allows to obtain up to 850 wafers* of 50.8mm in diameter and 0.7mm thick in 2 – 2.5 hours.

*for use in the watch making industry

Titan-P: a view on the cooling-lubricating fluid unit.
Titan-P: a view on the cooling-lubricating fluid unit.

Installation requirements

A shop with the following parameters:

– temperature 18 – 30°?;

– relative humidity below 70%;

– there is now need for a special bedding;

Also:

– a premise of 9m2;

– a contour of grounding, with resistance value between the grounding bolt and any of accessible parts of the device should be 0.1ohm or lower.

Operational supplies:

Titan-P: slicing of a 200mm (7.8 inches) sapphire ingot into wafers.
Slicing of a 200mm (7.8'') sapphire ingot into wafers.

Compressed air, purified to the level of at least 12, in accordance with GOST17433 and supplied under 6.3?10E5Pa of pressure (6.42kg/cm2).

The power supply of the device is realized by three-phase four-wire (with a zero wire) networks of alternating electrical current with a voltage of 380V(Volt), a frequency of 50(60)Hz.

Quality standards of electrical current should meet the requirements of GOST 1.3109-87.