Wafer slicing saws
Pryroda manufactures equipment for wafer slicing of sapphire (Al2O3) and other hard and super-hard mono and poly crystalline materials, notably silicium (Si), corundum and others.
Pryroda’s wafer slicing saw Titan-P uses a diamond coated wire technology.
A combination of electric drive with high-torque electric motors and SIEMENS controlling units allows reaching of slicing speeds of 15 square mm per minute for super-hard materials.
149 wafers of 50.8mm in 2 – 2.5hours
An ingot of 50.8mm in diameter could be sliced in 2 – 2.5 hours producing up to 149 wafers simultaneously.
For watch industry: up to 850 wafers of 50.8mm in 2 – 2.5hours
An additional appliance extends productivity to 850 simultaneously obtained wafers for watch crystals in just 2 – 2.5 hours. Indeed, in wafer slicing intended for use in the watch industry, the exact crystallographic orientation is not required. This simplifies the design and allows higher productivity.
Distinctive quality
The distinctive quality of Titan-P wafer slicing saw designed by Pryroda is a high reliability of the mechanisms despite a high wind speed of the diamond coated wire. This allows avoiding wire breaks during slicing process.
In Pryroda’s design, the cutting force transmitted to the wire is not accumulated on the extremities.
For such design, the only limitation on the number of wafers is the mechanical strength of the sliced ingot. Indeed, in slicing with rotation, the central kernel receives a force load proportional to the length of the ingot.
Titan-P: a wafer slicing wire saw with a diamond coated wire
Highlights
- Good productivity and reliability;
- Successfully operated by renowned sapphire manufacturers;
- Comes along with an extensive technological support for implementation;
- Covered for after-sale support and parts;
Description
The device is intended for slicing of poly crystal and single crystal ingots, notably of sapphire monocrystals, as well as for slicing of other hard or superhard materials. Slicing is done by a diamond coated wire.
Technical Characteristics (Main configuration)
Diameter of sliced ingots, mm: up to 300mm
Length of sliced ingots, mm: up to 150
Weight of sliced ingots, maximum, kg: 11.5
Wire winding speed, m/s: 0.3 – 15
Transversal approach speed,
mm/min.: 0.07 – 1
Number of wafers from one cycle of cutting (thickness of 0.7mm), pieces: 149
Duration of one cycle with a sapphire ingot of 50.8mm in diameter and 150mm in length (resulting in 149 wafers), hours: 2 – 2.5
WARP, micro meters: 10 – 30
Ra, micro meters: 0.7 – 0.8
Weight of the device, kg: 1310
Watch industry configuration:
One cycle of slicing allows to obtain up to 850 wafers* of 50.8mm in diameter and 0.7mm thick in 2 – 2.5 hours.
*for use in the watch making industry
Installation requirements
A shop with the following parameters:
– temperature 18 – 30°?;
– relative humidity below 70%;
– there is now need for a special bedding;
Also:
– a premise of 9m2;
– a contour of grounding, with resistance value between the grounding bolt and any of accessible parts of the device should be 0.1ohm or lower.
Operational supplies:
Compressed air, purified to the level of at least 12, in accordance with GOST17433 and supplied under 6.3?10E5Pa of pressure (6.42kg/cm2).
The power supply of the device is realized by three-phase four-wire (with a zero wire) networks of alternating electrical current with a voltage of 380V(Volt), a frequency of 50(60)Hz.
Quality standards of electrical current should meet the requirements of GOST 1.3109-87.